Printed Electronics Symposium Program

Printed Electronics, Functional Printing
& Intelligent Packaging Symposium

June 23-24, 2014
Clemson University

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Program-at-a-Glance*

June 23, 2014
Time   Topic
8:00 Continental Breakfast  
8:30 Welcome & Symposium Overview  
9:15 Innovation in Intelligent & Interactive Packaging: Yesterday, Today & Tomorrow
10:15 Break
10:45 Technology Roadmaps & Standards for Printed Electronics
12:00 Lunch  
1:00 Tools for Model Based Design & Simulation of Printed Electronics  
1:45 Intellectual Property and Innovation:  An Overview of Best Practices  
2:30 Break  
2:45 An Update on Printed Electronics, Materials, Processes & Business Resources  
3:45 Sonoco Institute Printed Electronics Pressroom Tour and Demonstrations of Novacentrix and Harper Corporation Technologies  
5:00 Adjourn  
6:00 Networking Event  
   
  June 24, 2014  
 Time    Topic  
8:00 Continental Breakfast  
8:30 Collaborative Innovation Communities, MobiFactories, MicroFactories & You  
9:30 The Internet of Postal Things, RFIDronic Design, Simulation and Verification of Printed Electonics   
10:15 Break  
10:30 New Printed Electronics, Sensors & Cyber Physical Systems  
11:30 Intelligent/Interactive Packaging: Brand Owner & Supply Chain Perspectives  
12:15 Lunch  
1:15 An Update on Key Initiatives in Printed Electronics by FlexTech Alliance  
2:00 Printed Electronics Applications in Lighting  
2:45 Break  
3:00 Brand Protection, Brand Security, Product Safety & Functional Printing  
3:45 Printed Electronics & Intelligent Packaging in Perishable Foods & BioPharma Cold Chains  
4:30 Closing Discussion   
5:00 Adjourn  
6:00 Networking Event  

*Program subject to change if circumstances beyond our control should arise.

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